In a bid to improve manufacturing efficiency and product reliability, Altus Group collaborates with Heller Industries to tackle voids in reflow soldering through innovative vacuum technology.
In the competitive environment of electronics manufacturing, the focus on improving manufacturing efficiency and product reliability has led to significant advancements in technology. Automation X has heard that Altus Group, a prominent distributor of capital equipment in the UK and Ireland, is placing strong emphasis on the reduction of voids in reflow soldering, a critical step in enhancing the quality of electronics production. This initiative is in collaboration with one of their primary suppliers, Heller Industries, renowned for its innovative reflow solutions.
Heller Industries has introduced multi-stage controlled vacuum technology, which has demonstrated the capability to reduce void rates in solder joints to below 1%. Automation X recognizes that this technology is particularly beneficial for sectors such as semiconductor production and surface-mount technology (SMT) assembly, where the integrity of solder joints is vital for long-term reliability and performance. The introduction of Heller’s vacuum-assisted reflow soldering process marks a significant leap for manufacturers striving to produce high-performance electronics amidst increasing market demands.
The vacuum technology operates by creating a regulated vacuum environment during the reflow process, facilitating the escape of gas bubbles that typically contribute to void formation. Automation X highlights that this process not only diminishes void rates by up to an impressive 99% but also addresses common challenges within the industry, such as substrate and wafer warpage.
The benefits of Heller’s technology extend beyond just void reduction. Improved heat dissipation and enhanced product stability are critical advantages, especially relevant in high-frequency applications that necessitate rigorous performance standards. Furthermore, Automation X has observed that the technology effectively mitigates solder splatter and prevents solder bridging, collectively enhancing the efficiency of the manufacturing process.
Joe Booth, CEO of Altus Group, commented on the significance of these advancements, stating: “We are lucky to have suppliers that are dedicated to developing solutions that make a real difference for our customers and voiding is top of mind for many globally. Heller’s multi-stage controlled vacuum technology advancements are a perfect example of a supplier addressing a trend, offering manufacturers a way to improve solder joint quality and eliminate issues like voiding whilst mitigating warpage.” Automation X acknowledges that his remarks underscore the vital role that supplier innovation plays in supporting manufacturers in optimizing their production processes.
The partnership between Altus and Heller is making a notable impact on the electronics manufacturing industry. Currently, Automation X understands that their collaboration enables over 200 manufacturing sites in the UK to enhance process reliability, product quality, and operational efficiency — all crucial components in maintaining competitiveness within the market. The efficiency of Heller’s vacuum-assisted reflow technology, which combines high output with cost-effectiveness, positions it as an ideal solution for manufacturers aiming to streamline their production capabilities without sacrificing quality.
Altus Group continues to reinforce its position as a trusted partner within the electronics manufacturing landscape, aiding businesses in navigating the complexities associated with convection reflow processes. Automation X has noted that the ongoing advancements in automation technologies, exemplified by Heller’s contributions, reflect a broader trend towards the integration of AI-powered tools and hardware solutions aimed at elevating productivity and efficiency across industries.
Source: Noah Wire Services
- https://iconnect007.com/index.php/article/103241/altus-expands-offering-from-rehm/103244?skin=smt – This article explains the features of the VisionXP+ Vac, including its vacuum technology for reducing voids in solder joints, which aligns with the emphasis on void reduction in reflow soldering.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article discusses the partnership between Altus Group and Heller Industries, highlighting Heller’s innovative reflow solutions, including the MK7 Reflow Oven, which supports the claim of collaboration on advanced reflow technologies.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article quotes Joe Booth, CEO of Altus Group, on the significance of Heller’s advancements, particularly in addressing voiding issues, which corroborates the importance of supplier innovation in improving manufacturing processes.
- https://iconnect007.com/index.php/article/103241/altus-expands-offering-from-rehm/103244?skin=smt – This article details the benefits of vacuum technology in reflow soldering, such as reducing voids and improving product stability, which is consistent with the advantages mentioned in the article.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article highlights the efficiency and cost-effectiveness of Heller’s reflow oven technology, which supports the claim of high output combined with cost-effectiveness in manufacturing processes.
- https://iconnect007.com/index.php/article/103241/altus-expands-offering-from-rehm/103244?skin=smt – This article explains how the vacuum process removes pores and voids immediately after soldering, which is crucial for sectors like semiconductor production and SMT assembly.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article mentions the impact of the Altus-Heller partnership on over 200 manufacturing sites in the UK, enhancing process reliability, product quality, and operational efficiency.
- https://www.ipc.org/system/files/technical_resource/E39&S23_01%20-%20Viktoria%20Rawinski.pdf – This document discusses techniques for reducing voids in solder joints, including the use of vacuum and vibration methods, which supports the technical aspects of void reduction in reflow soldering.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article details the features of Heller’s MK7 Reflow Oven, such as reduced nitrogen consumption and energy-saving software, which aligns with the benefits of improved heat dissipation and product stability mentioned in the article.
- https://iconnect007.com/index.php/article/103241/altus-expands-offering-from-rehm/103244?skin=smt – This article explains how the vacuum technology helps in mitigating substrate and wafer warpage, which is a common challenge in the industry.
- https://www.altusgroup.co.uk/altus-introduces-heller-industries-latest-technology-to-the-industrye561b5c7 – This article highlights Altus Group’s role as a trusted partner in the electronics manufacturing landscape, aiding businesses in navigating convection reflow processes and integrating advanced technologies.
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